WI400 Wafer Inspection Machine is designed specifically for top vision inspection for fabricated components on wafer such as lens, LED and IC packages. 

Specifications:

Equipped with high resolution imaging technology

Offers software alignment function to adjust wafer alignment angle for top vision inspection

Real Time Wafer Map Display

SPC statistical tools to monitor yield trend or defect breakdown. 

Minimum detectable defect size 15µm x 15µm

Inspection criteria include fresnel inspection, contamination, crack,wire bond, chipping , scratches, surface cosmetic, etc.

Confocal displacement sensor for warpage detection. Height compensation up to 2mm. 

 
 

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