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Auto Taping AT100

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AT100

Application
Package:
QFN / MLP bare lead frame
Hitachi thermal tape


Specification

  • Input:
    • Dual stack lead frame with interleaf
  • Preheat:
    • 120 to 150 ℃, +/-5 ℃
  • Cleaning:
    • Self rolling sticking roller
    • Motorized cleaning roller
  • Tape Input:
    • Motorized tape gripper
    • Pneumatic die set for taping cutting
  • Tape Preheat:
    • 120 ℃ to 150 ℃, +/-5 ℃
    • Gripper and vacuum nest to precise tape
  • Molding:
    • Servo press 30 tons
    • 250 ℃, +/- 5 ℃ with 8 settable zones
  • Post Cooling: 120 ℃ to 150 ℃, +/-5 ℃
  • Output: Dual stack lead frame with interleaf
  • UPH: 150 frame/hr @10 sec curing time
  • MTBA: 60 minutes

Clean Room / ESD

  • Build in roof top Hepa filter, Class 1K
  • Build in ESD ionizer fan

Mold Die design

  • Floating top mold design
  • Bottom mold use cushioning sheet
  • Use Special_C method for frame stripping

Quality

  • Tape accuracy +/- 0.2mm
  • 100% frame imprint
  • No frame warpage
  • No frame sticking / damage

Foot print

  • 2400 mm (L) x 2050 mm (W) x 2500 mm (H)

Facilities

  • Power: 208V 3 phase, 60A
  • CDA: 0.6 MPa (2 lines)

Warranty

  • 1 year limited, excluded tear & wear parts