Our Milestones
Milestone
1997
Micro Modular System Sdn. Bhd. (MMS) was incorporated in 1997, making jigs, fixtures and die-sets as well as Trim & Form systems and assembly machines for the electronics industry.
1999
Focused on test systems for the Semiconductor and Optoelectrics industry
2000
Our QMS was ISO 9000 certified for the first time. We have been passing re-certification biannually with passing colors.
2001
Developed the first LED Assembly System.
Began integrated machine design with our first clinching machine, the CM 100 and constant new improvements and innovations has kept this machine in demand. We also developed our first machine-control software platform in the same year.
2002
With an increase in demand for more complex and higher integrated automation, Evolusys Technologies was founded in 2002, in order to provide MMS with an improved software kernel, now common to most of MMS’ machines. Currently, Evolusys provides tailored test solutions, including user interface and machine integration. With the development of our turret-test handler in 2002 and the subsequent development of the VN200 and VN240 platform we are able to provide machines based on high-speed rotary turrets.
2004
In 2004 MMS Ventures (MMSV) was incorporated and was publicly listed as the holding company for MMS and Evolusys.
2005
We moved into our facility in Bayan Lepas, Phase IV. This provided us with about 90,000 square feet (approx. 8300 m2) of modern office, assembly and QC facilities, as well as an in-house metal fabrication factory.
2006
MMSV listed on Bursa Securities
ACE Market (0113)
2011
We shifted our focus further to machines for the LED production process in 2011. Building on our extensive knowledge of LED testing and in combination with our existing solutions for test handling, sorting, singulation, laser marking and more, we are now able to cover the whole backend process of low- to high-power LED production and test.
2013
Developed a new range Automated Optical Inspection (AOI) vision system
2017
Expanded to Front End Semiconductor (Wafer Inspection Machine)
2018
Transferred to Main Market
2021
Initiated new R&D projects to engage developing Die Sorter and Wafer-to-Wafer machine
2022
Shift focus to potential new R&D projects in line with 5G, Industry 4.0 and IoT to expand competitive edge